The CRF series reed relay is a low-profile device made with a ceramic case that exactly matches the thermal coefficient of expansion of the reed switch glass and the reed lead to eliminate any potential packaging stress. This reed relay is the smallest in the industry and switches in the billions of operations.
The relay has 1 mV typical thermal offset voltage. Measuring only 8.6mm x 4.4 mm x 3.4 mm, the leadless design eliminates skewing of leads and co-planarity issues.
ceramic / thermoset molded package
patent pending
smallest in the industry
no lead frame surface mount design eliminates skewing of leads and co-planarity issues
available with BGA (Ball Grid Array)
internal magnetic shield standard
very low profile
gold plated leads
low thermal offset typical of 1 µV
TCE matching of all internal components
insulation resistance typical of 1014 Ohms