Soldering Paste

Solder paste ® ''Clear'' is a homogenous, ready-made, odourless mixture made of metal powder, binding agents, solvents and fluxes

It is free of any thixotropic agents, therefore a steady viscosity is guaranteed.

This paste has excellent wetting qualities and is also excellent for soldering of difficult solderable surfaces as chem. Ni/Au, chem. Ag or OSP.

No-Clean solder paste for an excellent wetting on all known surfaces.

Flux, DIN EN 29454, 1.2.3.C, DIN EN 61190-1-3, REL0, IPC J-STD-004B, REL0 Metall powder content 88,5% (standard viscosity) resp. 85 % (dispenser viscosity)