ERmet ZD connectors were developed for differential high-speed signal transmission in telecom applications with data rates of up to 10 Gbits/sec.
This robust, high quality modular connector system is just as wellsuited for use in conjunction with the 2mm HM (IED 61076-4-101) ERmet line of connectors.
Features
Design: Wafers with individually shielded pairs of contacts
Contacts: Low noise, dual beam, leaf contacts with one ground blade for every pair of signals
Wafer pitch: 2.5 mm from wafer to Wafer
Pitch between signal pins: 1.5 mm between pairs (within wafer)
Pitch between pairs: 4.5 mm (within wafer)
Ground arrangement: In line with signals at termination and surrounding shield
Multiline Crosstalk < 3% at 100 PS
Differential Impedance: 100 Ω ±10%
Power Modules: Closed entry, vertical female backplane modules with stamped blades
Alignment Features: Improved pre-alignment guide and polarizing features, 4 rigid blades for all modules
The 4 pair ERmet ZD male connectors provides in the 10 wafer version 40 contact pairs (80 Signal contacts and 40 ground contacts). The L-shaped shields are robust mechanical structures that provide an ideal differential evironment as well as protecting the signal pins ad resisting deflection that could cause stubbing.
Termination Pressfit